Solder paste dispensing for laser and induction
The soldering market is heading towards smaller and smaller applications. Therefore, the size of the solder wire and the influence of its contact with the components become a limit for the achievable process accuracy.
In order to ensure the excellence of its induction and laser processes with the smallest parts, Unitechnologies now has the capability to integrate mta® solder paste dispensing devices. This is integrated directly next to the soldering head, and within the same equipment.
The proximity between the solder paste dispenser and the soldering process ensures a perfect mastering of the complete process. Moreover, due to the complete integration of both process steps within the same automated equipment, the investment costs can be optimized.